There are no models available for this part yet.
Overview of X28C010RMB-25 by Intersil Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
Price & Stock for X28C010RMB-25 by Intersil Corporation
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
2156-X28C010RMB-25-ND
|
DigiKey | IC EEPROM 1MBIT PARALLEL 32CSOP Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
10 In Stock |
|
$909.9400 | Buy Now | |
| Rochester Electronics | X28C010 - 5V, Byte Alterable EEPROM ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 10 |
|
$780.8800 / $918.6800 | Buy Now |
CAD Models for X28C010RMB-25 by Intersil Corporation
Part Data Attributes for X28C010RMB-25 by Intersil Corporation
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTERSIL CORP
|
|
Part Package Code
|
SOIC
|
|
Package Description
|
SOIC-32
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
250 ns
|
|
Additional Feature
|
PAGE WRITE
|
|
Command User Interface
|
NO
|
|
Data Polling
|
YES
|
|
JESD-30 Code
|
R-CDSO-G32
|
|
JESD-609 Code
|
e3
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
128KX8
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
SOP
|
|
Package Equivalence Code
|
SOP32,.56
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE
|
|
Page Size
|
256 words
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
5 V
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
MIL-STD-883
|
|
Standby Current-Max
|
0.0005 A
|
|
Supply Current-Max
|
0.05 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
MATTE TIN
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
DUAL
|
|
Toggle Bit
|
YES
|
|
Write Cycle Time-Max (tWC)
|
10 ms
|
Alternate Parts for X28C010RMB-25
This table gives cross-reference parts and alternative options found for X28C010RMB-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C010RMB-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-3826701MXA | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Teledyne e2v | X28C010RMB-25 vs 5962-3826701MXA |
| 5962-3826701MZX | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, MO-115, FP-32 | Micross Components | X28C010RMB-25 vs 5962-3826701MZX |
| 5962-3826701MZA | EEPROM, 128KX8, 250ns, Parallel, CMOS, FP-32 | Xicor Inc | X28C010RMB-25 vs 5962-3826701MZA |
| 5962-3826716QMX | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, DFP-32 | Maxwell Technologies | X28C010RMB-25 vs 5962-3826716QMX |
| 5962-3826701MUX | EEPROM, 128KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28C010RMB-25 vs 5962-3826701MUX |
| 5962-3826716QMC | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, DFP-32 | Data Device Corporation | X28C010RMB-25 vs 5962-3826716QMC |
| X28C010DMB-25 | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 | Xicor Inc | X28C010RMB-25 vs X28C010DMB-25 |
| 5962-3826701MXX | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERDIP-32 | Teledyne e2v | X28C010RMB-25 vs 5962-3826701MXX |
| 5962-3826701MUX | EEPROM, 128KX8, 250ns, Parallel, CMOS, CQCC32 | Microchip Technology Inc | X28C010RMB-25 vs 5962-3826701MUX |
| 5962-3826701MXB | EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Xicor Inc | X28C010RMB-25 vs 5962-3826701MXB |