X28C010GM-12
Xicor Inc
Description: EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32

Overview of X28C010GM-12 by Xicor Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

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Part Data Attributes for X28C010GM-12 by Xicor Inc

X28C010GM-12
Xicor Inc
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
XICOR INC
Package Description
FRIT SEALED, CERAMIC, LCC-32
Reach Compliance Code
unknown
Access Time-Max
120 ns
Command User Interface
NO
Data Polling
YES
JESD-30 Code
R-GQCC-N32
JESD-609 Code
e0
Length
13.97 mm
Memory Density
1048576 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
QCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Page Size
256 words
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Seated Height-Max
3.048 mm
Standby Current-Max
0.0005 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Toggle Bit
YES
Width
11.43 mm
Want to compare parts?
  1. X28C010GM-12
    Xicor Inc
    EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32
    VS

Alternate Parts for X28C010GM-12

This table gives cross-reference parts and alternative options found for X28C010GM-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C010GM-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
X28C010E-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc X28C010GM-12 vs X28C010E-12
FT28C010-12EMB EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd X28C010GM-12 vs FT28C010-12EMB
FT28C010-12EI-X EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd X28C010GM-12 vs FT28C010-12EI-X
FT28C010-12EB-AT EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd X28C010GM-12 vs FT28C010-12EB-AT
PYX28C010-12L32M EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, 0.550 X 0.450 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation X28C010GM-12 vs PYX28C010-12L32M
X28C010GM-12T1 EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc X28C010GM-12 vs X28C010GM-12T1
FT28C010-12EM-X EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Force Technologies Ltd X28C010GM-12 vs FT28C010-12EM-X
PYX28C010-12L32MB EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, 0.550 X 0.450 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation X28C010GM-12 vs PYX28C010-12L32MB
AT28C010-12EM/883 EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation X28C010GM-12 vs AT28C010-12EM/883
X28C010GMB-12T1 EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc X28C010GM-12 vs X28C010GMB-12T1
Part Number Description Manufacturer Compare
AT28C010-12EM EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation X28C010GM-12 vs AT28C010-12EM
28C011TRTFI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32 Maxwell Technologies X28C010GM-12 vs 28C011TRTFI-12
X28C010JI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 Xicor Inc X28C010GM-12 vs X28C010JI-12
28C010TRT1DI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010GM-12 vs 28C010TRT1DI-12
X28C010PM-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, PDIP32, PLASTIC, DIP-32 Xicor Inc X28C010GM-12 vs X28C010PM-12
28C010TRT1DE-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010GM-12 vs 28C010TRT1DE-12
28C011TRT1FI-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32 Data Device Corporation X28C010GM-12 vs 28C011TRT1FI-12
FT28C010-12D-X EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Force Technologies Ltd X28C010GM-12 vs FT28C010-12D-X
28C010TRT4DB-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Data Device Corporation X28C010GM-12 vs 28C010TRT4DB-12
AT28C010E-12BM EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Atmel Corporation X28C010GM-12 vs AT28C010E-12BM

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