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Overview of X24C02PI-2.7 by IC Microsystems Sdn Bhd
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for X24C02PI-2.7 by IC Microsystems Sdn Bhd
Part Data Attributes for X24C02PI-2.7 by IC Microsystems Sdn Bhd
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
IC MICROSYSTEMS SDN BHD
|
Part Package Code
|
DIP
|
Package Description
|
DIP, DIP8,.3
|
Pin Count
|
8
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Clock Frequency-Max (fCLK)
|
0.1 MHz
|
Data Retention Time-Min
|
100
|
Endurance
|
100000 Write/Erase Cycles
|
I2C Control Byte
|
1010DDDR
|
JESD-30 Code
|
R-PDIP-T8
|
JESD-609 Code
|
e0
|
Length
|
10.03 mm
|
Memory Density
|
2048 bit
|
Memory IC Type
|
EEPROM
|
Memory Width
|
8
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
8
|
Number of Words
|
256 words
|
Number of Words Code
|
256
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
256X8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP8,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
240
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
4.07 mm
|
Serial Bus Type
|
I2C
|
Standby Current-Max
|
0.00003 A
|
Supply Current-Max
|
0.002 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
7.62 mm
|
Write Cycle Time-Max (tWC)
|
10 ms
|
Write Protection
|
HARDWARE
|
Alternate Parts for X24C02PI-2.7
This table gives cross-reference parts and alternative options found for X24C02PI-2.7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X24C02PI-2.7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
X24C02P-2.7 | EEPROM, 256X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Xicor Inc | X24C02PI-2.7 vs X24C02P-2.7 |
X24C02PM-2.7 | EEPROM, 256X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Xicor Inc | X24C02PI-2.7 vs X24C02PM-2.7 |
X24C02DM-2.7 | EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8 | Xicor Inc | X24C02PI-2.7 vs X24C02DM-2.7 |
X24C02DMB-2.7 | EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8 | Xicor Inc | X24C02PI-2.7 vs X24C02DMB-2.7 |
SLA24C02-D-3/P | EEPROM, 256X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Infineon Technologies AG | X24C02PI-2.7 vs SLA24C02-D-3/P |
SLA24C02-D-3 | EEPROM, 256X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Siemens | X24C02PI-2.7 vs SLA24C02-D-3 |
BR24C02 | EEPROM, 256X8, Serial, CMOS, PDIP8, DIP-8 | ROHM Semiconductor | X24C02PI-2.7 vs BR24C02 |
IS24C02A-3PA | EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Integrated Silicon Solution Inc | X24C02PI-2.7 vs IS24C02A-3PA |
XL24C02P | EEPROM, 256X8, Serial, CMOS, PDIP8, | Exel Microelectronics Inc | X24C02PI-2.7 vs XL24C02P |
AT24C02-10PQ-2.7 | EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-001BA, DIP-8 | Atmel Corporation | X24C02PI-2.7 vs AT24C02-10PQ-2.7 |