X2212DI/10
Xicor Inc
Description: Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18

Overview of X2212DI/10 by Xicor Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Industrial Automation Aerospace and Defense Communication and Networking

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Part Data Attributes for X2212DI/10 by Xicor Inc

X2212DI/10
Xicor Inc
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
XICOR INC
Package Description
HERMETIC SEALED, CERDIP-18
Reach Compliance Code
unknown
Access Time-Max
300 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T18
JESD-609 Code
e0
Memory Density
1024 bit
Memory IC Type
NON-VOLATILE SRAM
Memory Width
4
Number of Functions
1
Number of Ports
1
Number of Terminals
18
Number of Words
256 words
Number of Words Code
256
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
256X4
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
NMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
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  1. X2212DI/10
    Xicor Inc
    Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18
    VS

Alternate Parts for X2212DI/10

This table gives cross-reference parts and alternative options found for X2212DI/10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X2212DI/10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
X2212D/5 Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212D/5
X2212D Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212D
X2212D/10 Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212D/10
X2212DI Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212DI
Part Number Description Manufacturer Compare
X2212D/5 Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212D/5
X2212AP Non-Volatile SRAM, 256X4, 250ns, NMOS, PDIP18, PLASTIC, DIP-18 Xicor Inc X2212DI/10 vs X2212AP
S-22H12I10 Non-Volatile SRAM, 256X4, 200ns, CMOS, PDIP18, DIP-18 ABLIC Inc. X2212DI/10 vs S-22H12I10
S-22S12I10 256X4 NON-VOLATILE SRAM, 200ns, PDIP18, DIP-18 Epson Electronics America Inc X2212DI/10 vs S-22S12I10
CAT22C12PI-30 Non-Volatile SRAM, 256X4, 300ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Catalyst Semiconductor X2212DI/10 vs CAT22C12PI-30
X22C12P Non-Volatile SRAM, 256X4, 150ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Xicor Inc X2212DI/10 vs X22C12P
X2212DM/10 Non-Volatile SRAM, 256X4, 300ns, CMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212DM/10
X2212D Non-Volatile SRAM, 256X4, 300ns, NMOS, CDIP18, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X2212D
X22C12D Non-Volatile SRAM, 256X4, 150ns, CMOS, CDIP18, 0.300 INCH, HERMETIC SEALED, CERDIP-18 Xicor Inc X2212DI/10 vs X22C12D
CAT22C12P-20 Non-Volatile SRAM, 256X4, 200ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Catalyst Semiconductor X2212DI/10 vs CAT22C12P-20

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