Part Details for WSF512K16-39G2M by White Electronic Designs Corp
Overview of WSF512K16-39G2M by White Electronic Designs Corp
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Part Details for WSF512K16-39G2M
WSF512K16-39G2M CAD Models
WSF512K16-39G2M Part Data Attributes
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WSF512K16-39G2M
White Electronic Designs Corp
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WSF512K16-39G2M
White Electronic Designs Corp
Memory Circuit, Flash+SRAM, 512KX16, CMOS, CQFP68, 0.880 X 0.880 INCH, HERMETIC SEALED, CERAMIC, QFP-68
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | 0.880 X 0.880 INCH, HERMETIC SEALED, CERAMIC, QFP-68 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 90 ns | |
Additional Feature | SRAM IS ORGANISED AS 512K X 16 | |
JESD-30 Code | S-CQFP-G68 | |
JESD-609 Code | e4 | |
Length | 22.36 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Mixed Memory Type | FLASH+SRAM | |
Number of Functions | 1 | |
Number of Terminals | 68 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 512KX16 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QFP | |
Package Equivalence Code | QFP68,.99SQ,50 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.1 mm | |
Standby Current-Max | 0.035 A | |
Supply Current-Max | 0.26 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 22.36 mm |