Part Details for WS57C51C-55TI by STMicroelectronics
Overview of WS57C51C-55TI by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS57C51C-55TI
WS57C51C-55TI CAD Models
WS57C51C-55TI Part Data Attributes
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WS57C51C-55TI
STMicroelectronics
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Datasheet
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WS57C51C-55TI
STMicroelectronics
16KX8 UVPROM, 55ns, CDIP28, 0.300 INCH, CERDIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.085 mm | |
| Memory Density | 131072 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.035 A | |
| Supply Current-Max | 0.133 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for WS57C51C-55TI
This table gives cross-reference parts and alternative options found for WS57C51C-55TI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS57C51C-55TI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C128-120LIB | UVPROM, 16KX8, 120ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS57C51C-55TI vs AM27C128-120LIB |
| TMS27C128-12JE4 | 16KX8 UVPROM, 120ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | WS57C51C-55TI vs TMS27C128-12JE4 |
| 27C128-20I/J | 16K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | WS57C51C-55TI vs 27C128-20I/J |
| TD27128A-20 | UVPROM, 16KX8, 200ns, NMOS, CDIP28, CERDIP-28 | Intel Corporation | WS57C51C-55TI vs TD27128A-20 |
| NMC27C128BQE200 | IC 16K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | WS57C51C-55TI vs NMC27C128BQE200 |
| AM27C128-45LIB | UVPROM, 16KX8, 45ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS57C51C-55TI vs AM27C128-45LIB |
| AM27C128-70LIB | UVPROM, 16KX8, 70ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS57C51C-55TI vs AM27C128-70LIB |
| CY27C128-200WMB | UVPROM, 16KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | WS57C51C-55TI vs CY27C128-200WMB |
| AM27C128-255LEB | UVPROM, 16KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS57C51C-55TI vs AM27C128-255LEB |
| AM27C128-200/BUA | UVPROM, 16KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS57C51C-55TI vs AM27C128-200/BUA |