Datasheets
WS57C51C-55JI by:

OTP ROM, 16KX8, 55ns, CMOS, PQCC32, PLASTIC, LDCC-32

Part Details for WS57C51C-55JI by Waferscale Integration Inc

Overview of WS57C51C-55JI by Waferscale Integration Inc

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Available Datasheets

Part # Manufacturer Description Datasheet
AM27C512-55JI-G Rochester Electronics AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
7006S55JI Renesas Electronics Corporation 16 K x 8 Dual-Port RAM
7025S55JI8 Renesas Electronics Corporation 8K x 16 Dual-Port RAM

Part Details for WS57C51C-55JI

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WS57C51C-55JI Part Data Attributes

WS57C51C-55JI Waferscale Integration Inc
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WS57C51C-55JI Waferscale Integration Inc OTP ROM, 16KX8, 55ns, CMOS, PQCC32, PLASTIC, LDCC-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer WAFERSCALE INTEGRATION INC
Package Description PLASTIC, LDCC-32
Reach Compliance Code unknown
Access Time-Max 55 ns
JESD-30 Code R-PQCC-J32
JESD-609 Code e0
Memory Density 131072 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 16384 words
Number of Words Code 16000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.035 A
Supply Current-Max 0.133 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD

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