Datasheets
WS57C128FB-45L by:

16KX8 UVPROM, 45ns, CQCC32, CERAMIC, LDCC-32

Part Details for WS57C128FB-45L by STMicroelectronics

Overview of WS57C128FB-45L by STMicroelectronics

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Part Details for WS57C128FB-45L

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WS57C128FB-45L Part Data Attributes

WS57C128FB-45L STMicroelectronics
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WS57C128FB-45L STMicroelectronics 16KX8 UVPROM, 45ns, CQCC32, CERAMIC, LDCC-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code QFN
Package Description CERAMIC, LDCC-32
Pin Count 32
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 45 ns
I/O Type COMMON
JESD-30 Code R-CQCC-J32
JESD-609 Code e0
Length 13.945 mm
Memory Density 131072 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 16384 words
Number of Words Code 16000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WQCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR
Package Style CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Seated Height-Max 4.06 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.139 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.24 mm

Alternate Parts for WS57C128FB-45L

This table gives cross-reference parts and alternative options found for WS57C128FB-45L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS57C128FB-45L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C128-200LEB UVPROM, 16KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD WS57C128FB-45L vs AM27C128-200LEB
AM27C128-75DCB UVPROM, 16KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD WS57C128FB-45L vs AM27C128-75DCB
8202506ZX UVPROM, 16KX8, 150ns, CMOS, CQCC32, CERAMIC, LCC-32 Rochester Electronics LLC WS57C128FB-45L vs 8202506ZX
AM27C128-125DC UVPROM, 16KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD WS57C128FB-45L vs AM27C128-125DC
AM27C128-305LI UVPROM, 16KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD WS57C128FB-45L vs AM27C128-305LI
27C128-25I/J 16K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc WS57C128FB-45L vs 27C128-25I/J
CY7C251-65QMB UVPROM, 16KX8, 65ns, CMOS, LCC-32 Cypress Semiconductor WS57C128FB-45L vs CY7C251-65QMB
TMS27C128JL 131 072-Bit UV Erasable Programmable Read-Only Memory 28-CDIP Texas Instruments WS57C128FB-45L vs TMS27C128JL
NMC27C128BQE200 16KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments WS57C128FB-45L vs NMC27C128BQE200
TMS27C128-3JL 16KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments WS57C128FB-45L vs TMS27C128-3JL

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