Part Details for WS512K8-55CQE by Mercury Systems Inc
Overview of WS512K8-55CQE by Mercury Systems Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS512K8-55CQE
WS512K8-55CQE CAD Models
WS512K8-55CQE Part Data Attributes
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WS512K8-55CQE
Mercury Systems Inc
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Datasheet
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WS512K8-55CQE
Mercury Systems Inc
SRAM Module, 512KX8, 55ns, CMOS, CDMA32,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MERCURY SYSTEMS INC | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-CDMA-T32 | |
| JESD-609 Code | e4 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | GOLD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for WS512K8-55CQE
This table gives cross-reference parts and alternative options found for WS512K8-55CQE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K8-55CQE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS512S8BN-55C | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | Twilight Technology Inc | WS512K8-55CQE vs DPS512S8BN-55C |
| 5962-9207805HXC | SRAM Module, 512KX8, 55ns, CMOS, DIP-32 | White Electronic Designs Corp | WS512K8-55CQE vs 5962-9207805HXC |
| DPS512S8BN-55I | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | Twilight Technology Inc | WS512K8-55CQE vs DPS512S8BN-55I |
| MS8512FK-55 | SRAM Module, 512KX8, 55ns, CMOS | Mosaic Semiconductor Inc | WS512K8-55CQE vs MS8512FK-55 |
| 5962-9561305HYC | Cache SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Micross Components | WS512K8-55CQE vs 5962-9561305HYC |
| 5962-9561305HYC | Cache SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Cobham Semiconductor Solutions | WS512K8-55CQE vs 5962-9561305HYC |
| WS512K8-55CC | SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, DUAL CAVITY, HERMETIC SEALED, BOTTOM BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS512K8-55CQE vs WS512K8-55CC |
| EDI8M8512C55C6B | SRAM Module, 512KX8, 55ns, CMOS, | Electronic Designs Inc | WS512K8-55CQE vs EDI8M8512C55C6B |
| 5962-9561305HYX | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Micross Components | WS512K8-55CQE vs 5962-9561305HYX |
| 5962-9207805HTC | SRAM Module, 512KX8, 55ns, CMOS, DIP-32 | Mercury Systems Inc | WS512K8-55CQE vs 5962-9207805HTC |