Part Details for WS512K32NV-15H1I by Mercury Systems Inc
Overview of WS512K32NV-15H1I by Mercury Systems Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for WS512K32NV-15H1I
WS512K32NV-15H1I CAD Models
WS512K32NV-15H1I Part Data Attributes
|
|
WS512K32NV-15H1I
Mercury Systems Inc
Buy Now
Datasheet
|
Compare Parts:
WS512K32NV-15H1I
Mercury Systems Inc
SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MERCURY SYSTEMS INC | |
| Package Description | PGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 15 ns | |
| Additional Feature | USER CONFIGURABLE AS 2 X 512K X 16 OR 4 X 512K X 8 | |
| JESD-30 Code | S-CPGA-P66 | |
| JESD-609 Code | e4 | |
| Length | 27.3 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.6 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | GOLD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27.3 mm |
Alternate Parts for WS512K32NV-15H1I
This table gives cross-reference parts and alternative options found for WS512K32NV-15H1I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K32NV-15H1I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS512K32NV-15H1M | SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | WS512K32NV-15H1I vs WS512K32NV-15H1M |
| WS512K32NV-15H1M | SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Mercury Systems Inc | WS512K32NV-15H1I vs WS512K32NV-15H1M |
| WS512K32NV-15H1MA | SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Mercury Systems Inc | WS512K32NV-15H1I vs WS512K32NV-15H1MA |