Datasheets
WS512K32N-35H1CA by:

SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Part Details for WS512K32N-35H1CA by Mercury Systems Inc

Overview of WS512K32N-35H1CA by Mercury Systems Inc

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Part Details for WS512K32N-35H1CA

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WS512K32N-35H1CA Part Data Attributes

WS512K32N-35H1CA Mercury Systems Inc
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WS512K32N-35H1CA Mercury Systems Inc SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MERCURY SYSTEMS INC
Package Description PGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 35 ns
Additional Feature USER CONFIGURABLE AS 2M X 8
Alternate Memory Width 16
JESD-30 Code S-CPGA-P66
JESD-609 Code e0
Length 27.3 mm
Memory Density 16777216 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 66
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.6 mm
Supply Current-Max 0.66 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 27.3 mm

Alternate Parts for WS512K32N-35H1CA

This table gives cross-reference parts and alternative options found for WS512K32N-35H1CA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K32N-35H1CA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WS512K32N-35H1QA SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WS512K32N-35H1CA vs WS512K32N-35H1QA
ACT-S512K32N-035P7T Cache SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66 Cobham PLC WS512K32N-35H1CA vs ACT-S512K32N-035P7T
5962-9461107HTA SRAM Module, 512KX32, 35ns, CMOS, CPGA66 Cobham Advanced Electronic Solutions WS512K32N-35H1CA vs 5962-9461107HTA
5962-9461107HTC Cache SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66 Cobham Power Products WS512K32N-35H1CA vs 5962-9461107HTC
5962-9461107HTC Cache SRAM Module, 512KX32, 35ns, CMOS, CPGA66, PGA-66 Micross Components WS512K32N-35H1CA vs 5962-9461107HTC
ACT-S512K32N-035P7Q Cache SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66 Cobham PLC WS512K32N-35H1CA vs ACT-S512K32N-035P7Q
5962-9461107HTX SRAM Module, 512KX32, 35ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 Cobham Semiconductor Solutions WS512K32N-35H1CA vs 5962-9461107HTX
5962-9461107HTC Cache SRAM Module, 512KX32, 35ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 Cobham Semiconductor Solutions WS512K32N-35H1CA vs 5962-9461107HTC
5962-9461107HTX SRAM Module, 512KX32, 35ns, CMOS, CHIP66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 Cobham Power Products WS512K32N-35H1CA vs 5962-9461107HTX
5962-9461107HTA SRAM Module, 512KX32, 35ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 Cobham Power Products WS512K32N-35H1CA vs 5962-9461107HTA
Part Number Description Manufacturer Compare
HMCE-65664AG-A:D Standard SRAM, 8KX8, 35ns, CMOS, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 Atmel Corporation WS512K32N-35H1CA vs HMCE-65664AG-A:D
M5M5278FP-35 Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 Mitsubishi Electric WS512K32N-35H1CA vs M5M5278FP-35
IDT71256SA20L32B Standard SRAM, 32KX8, 20ns, CMOS, CQCC32, LCC-32 Integrated Device Technology Inc WS512K32N-35H1CA vs IDT71256SA20L32B
WS128K32V-25G4MA SRAM Module, 512KX8, 25ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp WS512K32N-35H1CA vs WS128K32V-25G4MA
CY7C199CNL-15ZXC Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, LEAD FREE, PLASTIC, TSOP-28 Cypress Semiconductor WS512K32N-35H1CA vs CY7C199CNL-15ZXC
EDI8832C100LB Standard SRAM, 32KX8, 100ns, CMOS, CQCC32, Electronic Designs Inc WS512K32N-35H1CA vs EDI8832C100LB
HM465799M-2:RD Standard SRAM, 64KX4, 45ns, CMOS, CQCC28, 0.050 INCH PITCH, LCC-28 Atmel Corporation WS512K32N-35H1CA vs HM465799M-2:RD
IDT7M4013S30NHB SRAM Module, 128KX32, 30ns, CMOS, CPMA66 Integrated Device Technology Inc WS512K32N-35H1CA vs IDT7M4013S30NHB
DPS128X32CV3-35B SRAM Module, 512KX8, 35ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.252 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company WS512K32N-35H1CA vs DPS128X32CV3-35B
IDT7165S25TC Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, THIN, SIDE BRAZED, DIP-28 Integrated Device Technology Inc WS512K32N-35H1CA vs IDT7165S25TC

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