Datasheets
WS512K32N-25G2UM by:

SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

Part Details for WS512K32N-25G2UM by Mercury Systems Inc

Overview of WS512K32N-25G2UM by Mercury Systems Inc

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Part Details for WS512K32N-25G2UM

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WS512K32N-25G2UM Part Data Attributes

WS512K32N-25G2UM Mercury Systems Inc
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WS512K32N-25G2UM Mercury Systems Inc SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MERCURY SYSTEMS INC
Package Description QFP,
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns
Additional Feature USER CONFIGURABLE AS 2M X 8
Alternate Memory Width 16
JESD-30 Code S-CQFP-G68
JESD-609 Code e4
Length 22.36 mm
Memory Density 16777216 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 68
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.51 mm
Supply Current-Max 0.66 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish GOLD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 22.36 mm

Alternate Parts for WS512K32N-25G2UM

This table gives cross-reference parts and alternative options found for WS512K32N-25G2UM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K32N-25G2UM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WS128K32V-35G2UM SRAM Module, 128KX32, 35ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68 Mercury Systems Inc WS512K32N-25G2UM vs WS128K32V-35G2UM
AS8SLC128K32P-25L/883C SRAM Module, 128KX32, 25ns, CMOS, PGA-66 Micross Components WS512K32N-25G2UM vs AS8SLC128K32P-25L/883C
MT5C2568DCJ-12L/883C Standard SRAM, 32KX8, 12ns, CMOS, CDSO28, CERAMIC, SOJ-28 Micross Components WS512K32N-25G2UM vs MT5C2568DCJ-12L/883C
WS512K32N-20G2LI SRAM Module, 512KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc WS512K32N-25G2UM vs WS512K32N-20G2LI
FT7C192-25PI Standard SRAM, 64KX4, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Force Technologies Ltd WS512K32N-25G2UM vs FT7C192-25PI
AS8SLC128K32P-20/883C SRAM Module, 128KX32, 20ns, CMOS, CPGA66, PGA-66 Micross Components WS512K32N-25G2UM vs AS8SLC128K32P-20/883C
P4C164L-100LCLF Standard SRAM, 8KX8, 100ns, CMOS, CQCC28, 0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-28 Pyramid Semiconductor Corporation WS512K32N-25G2UM vs P4C164L-100LCLF
P4C1281-35PI Standard SRAM, 64KX4, 35ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Pyramid Semiconductor Corporation WS512K32N-25G2UM vs P4C1281-35PI
WS512K32N-35G2UMA SRAM Module, 512KX32, 35ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc WS512K32N-25G2UM vs WS512K32N-35G2UMA
WS512K32N-25G2UC SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Mercury Systems Inc WS512K32N-25G2UM vs WS512K32N-25G2UC

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