Part Details for WS512K32-55G2UQA by Microsemi Corporation
Overview of WS512K32-55G2UQA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS512K32-55G2UQA
WS512K32-55G2UQA CAD Models
WS512K32-55G2UQA Part Data Attributes
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WS512K32-55G2UQA
Microsemi Corporation
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Datasheet
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WS512K32-55G2UQA
Microsemi Corporation
SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | QFP | |
| Package Description | 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| Additional Feature | USER CONFIGURABLE AS 2M X 8 | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | S-CQFP-G68 | |
| Length | 22.36 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 3.51 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 22.36 mm |
Alternate Parts for WS512K32-55G2UQA
This table gives cross-reference parts and alternative options found for WS512K32-55G2UQA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K32-55G2UQA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS512K32-55G2UM | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WS512K32-55G2UQA vs WS512K32-55G2UM |
| WS512K32-55G2UCA | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WS512K32-55G2UQA vs WS512K32-55G2UCA |
| WS512K32-55G2UI | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | WS512K32-55G2UQA vs WS512K32-55G2UI |
| WS512K32-55G2UC | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | WS512K32-55G2UQA vs WS512K32-55G2UC |
| WS512K32-55G2UM | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | WS512K32-55G2UQA vs WS512K32-55G2UM |
| WS512K32-55G2UI | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WS512K32-55G2UQA vs WS512K32-55G2UI |
| WS512K32-55G2UCA | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Mercury Systems Inc | WS512K32-55G2UQA vs WS512K32-55G2UCA |
| WS512K32-55G2UQ | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WS512K32-55G2UQA vs WS512K32-55G2UQ |
| WS512K32-55G2UMA | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WS512K32-55G2UQA vs WS512K32-55G2UMA |
| WS512K32-55G2UIA | SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WS512K32-55G2UQA vs WS512K32-55G2UIA |