Part Details for WS512K32-25G2Q by White Electronic Designs Corp
Overview of WS512K32-25G2Q by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS512K32-25G2Q
WS512K32-25G2Q CAD Models
WS512K32-25G2Q Part Data Attributes
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WS512K32-25G2Q
White Electronic Designs Corp
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Datasheet
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WS512K32-25G2Q
White Electronic Designs Corp
SRAM Module, 2MX8, 25ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| Additional Feature | USER CONFIGURABLE AS 512K X 32 | |
| I/O Type | COMMON | |
| JESD-30 Code | S-CQFP-G68 | |
| JESD-609 Code | e0 | |
| Length | 22.4 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFP | |
| Package Equivalence Code | QFP68,.99SQ,50 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Seated Height-Max | 5.1 mm | |
| Standby Current-Max | 0.012 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.52 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 22.4 mm |
Alternate Parts for WS512K32-25G2Q
This table gives cross-reference parts and alternative options found for WS512K32-25G2Q. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K32-25G2Q, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS8S512K32Q-25/XT | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 | Micross Components | WS512K32-25G2Q vs AS8S512K32Q-25/XT |
| WS512K32-25G1UM | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | WS512K32-25G2Q vs WS512K32-25G1UM |
| WS512K32-25G1UQA | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | WS512K32-25G2Q vs WS512K32-25G1UQA |
| WS512K32-25G2CA | SRAM Module, 2MX8, 25ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | WS512K32-25G2Q vs WS512K32-25G2CA |
| WS512K32-25G1UMA | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | WS512K32-25G2Q vs WS512K32-25G1UMA |
| WS512K32-25G2QA | SRAM Module, 2MX8, 25ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | White Electronic Designs Corp | WS512K32-25G2Q vs WS512K32-25G2QA |
| ACT-S512K32N-025F2M | Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68 | Cobham PLC | WS512K32-25G2Q vs ACT-S512K32N-025F2M |
| 5962-9461108HMC | Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CO-FIRED CERAMIC,QFP-68 | Mercury Systems Inc | WS512K32-25G2Q vs 5962-9461108HMC |
| 5962-9461108H9X | Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 0.940 X 0.940 INCH, 0.140 INCH HEIGHT, SINGLE CAVITY, CERAMIC, QFP-68 | Cobham Power Products | WS512K32-25G2Q vs 5962-9461108H9X |
| 5962-9461108HMA | SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CO-FIRED CERAMIC,QFP-68 | White Microelectronics | WS512K32-25G2Q vs 5962-9461108HMA |