Part Details for WS27C256F-90CMB by Waferscale Integration Inc
Overview of WS27C256F-90CMB by Waferscale Integration Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Part Details for WS27C256F-90CMB
WS27C256F-90CMB CAD Models
WS27C256F-90CMB Part Data Attributes
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WS27C256F-90CMB
Waferscale Integration Inc
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Datasheet
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WS27C256F-90CMB
Waferscale Integration Inc
UVPROM, 32KX8, 90ns, CMOS, CQCC32,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WAFERSCALE INTEGRATION INC | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 90 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CQCC-N32 | |
JESD-609 Code | e0 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM CARD | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCN | |
Package Equivalence Code | LCC32,.45X.55 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 Class B | |
Standby Current-Max | 0.0005 A | |
Supply Current-Max | 0.078 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD |
Alternate Parts for WS27C256F-90CMB
This table gives cross-reference parts and alternative options found for WS27C256F-90CMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS27C256F-90CMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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5962-8606317YA | UVPROM, 32KX8, 90ns, CMOS, CQCC32, CERAMIC, LCC-32 | QP Semiconductor | WS27C256F-90CMB vs 5962-8606317YA |
FT27C256R-90LM/883 | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Force Technologies Ltd | WS27C256F-90CMB vs FT27C256R-90LM/883 |
27HC256-90I/K | 32K X 8 UVPROM, 90 ns, CQCC32, CERAMIC, LCC-32 | Microchip Technology Inc | WS27C256F-90CMB vs 27HC256-90I/K |
AM27C256-95LIB | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS27C256F-90CMB vs AM27C256-95LIB |
5962-8606317YX | UVPROM, 32KX8, 90ns, CMOS, CQCC32, CERAMIC, LCC-32 | QP Semiconductor | WS27C256F-90CMB vs 5962-8606317YX |
5962-8606307YA | UVPROM, 32KX8, 90ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | WS27C256F-90CMB vs 5962-8606307YA |
AM27C256-90/BUA | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS27C256F-90CMB vs AM27C256-90/BUA |
AM27C256-95LI | UVPROM, 32KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | WS27C256F-90CMB vs AM27C256-95LI |
5962-8606317YX | UVPROM, 32KX8, 90ns, CMOS, CQCC32, CERAMIC, LCC-32 | Micross Components | WS27C256F-90CMB vs 5962-8606317YX |
AS27C256-90ECAM | UVPROM, 32KX8, 90ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | WS27C256F-90CMB vs AS27C256-90ECAM |