Datasheets
WS1M8-17CC by:

Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32

Part Details for WS1M8-17CC by Microsemi Corporation

Overview of WS1M8-17CC by Microsemi Corporation

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Applications Consumer Electronics Audio and Video Systems

Part Details for WS1M8-17CC

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WS1M8-17CC Part Data Attributes

WS1M8-17CC Microsemi Corporation
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WS1M8-17CC Microsemi Corporation Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROSEMI CORP
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 17 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS
JESD-30 Code R-CDIP-T32
Memory Density 8388608 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.13 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for WS1M8-17CC

This table gives cross-reference parts and alternative options found for WS1M8-17CC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS1M8-17CC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WS1M8-17CM Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WS1M8-17CC vs WS1M8-17CM
Part Number Description Manufacturer Compare
WS1M8-100CIA Standard SRAM, 1MX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WS1M8-17CC vs WS1M8-100CIA
WS1M8V-55CMA Standard SRAM, 1MX8, 55ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WS1M8-17CC vs WS1M8V-55CMA
WS1M8-25CC Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WS1M8-17CC vs WS1M8-25CC
WS1M8L-20CMA Standard SRAM, 1MX8, 20ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics WS1M8-17CC vs WS1M8L-20CMA
WS1M8-20CMA Standard SRAM, 1MX8, 20ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WS1M8-17CC vs WS1M8-20CMA
DPS1MS8MP-15C SRAM Module, 1MX8, 150ns, CMOS, CDMA32, 0.600 INCH, DIP-32 Twilight Technology Inc WS1M8-17CC vs DPS1MS8MP-15C
WS1M8L-55CI Standard SRAM, 1MX8, 55ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics WS1M8-17CC vs WS1M8L-55CI
DPS1MX8MKN345IA Standard SRAM, 1MX8, 45ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 B&B Electronics Manufacturing Company WS1M8-17CC vs DPS1MX8MKN345IA
WS1M8-100CM Standard SRAM, 1MX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation WS1M8-17CC vs WS1M8-100CM
WS1M8L-35CCA Standard SRAM, 1MX8, 35ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics WS1M8-17CC vs WS1M8L-35CCA

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