Memory
WS128K32V-25G2UI
Description: SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68

Overview of WS128K32V-25G2UI by Microsemi Corporation

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Part Data Attributes for WS128K32V-25G2UI by Microsemi Corporation

WS128K32V-25G2UI
Microsemi Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Transferred
Ihs Manufacturer
MICROSEMI CORP
Part Package Code
QFP
Package Description
22.40 X 22.40 MM, CERAMIC, QFP-68
Pin Count
68
Reach Compliance Code
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
25 ns
Additional Feature
ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
JESD-30 Code
S-CQFP-G68
JESD-609 Code
e4
Length
22.36 mm
Memory Density
4194304 bit
Memory IC Type
SRAM MODULE
Memory Width
32
Number of Functions
1
Number of Terminals
68
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
Package Shape
SQUARE
Package Style
FLATPACK
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
3.51 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
GOLD
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Width
22.36 mm
Want to compare parts?
  1. WS128K32V-25G2UI
    Microsemi Corporation
    SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68
    VS

Alternate Parts for WS128K32V-25G2UI

This table gives cross-reference parts and alternative options found for WS128K32V-25G2UI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS128K32V-25G2UI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
WS128K32V-25G2UIA SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs WS128K32V-25G2UIA
Part Number Description Manufacturer Compare
WS128K32-35G4TM SRAM Module, 128KX32, 35ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs WS128K32-35G4TM
5962F0422701QXC SRAM Module, 512KX8, 17ns, CMOS, CQFP68, CERAMIC, QFP-68 Cobham Semiconductor Solutions WS128K32V-25G2UI vs 5962F0422701QXC
WS128K32-17G2LMA SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 22.40 MM, 5.08 MM HEIGHT, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs WS128K32-17G2LMA
5962-9559507HNX SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs 5962-9559507HNX
5962-9559506HXX SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs 5962-9559506HXX
5962-9559515H9X SRAM Module, 128KX32, 25ns, CMOS, DIE Microsemi Corporation WS128K32V-25G2UI vs 5962-9559515H9X
PUMA68S4000M-45 512KX8 MULTI DEVICE SRAM MODULE, 45ns, PQCC68 Mosaic Semiconductor Inc WS128K32V-25G2UI vs PUMA68S4000M-45
5962-9559512HXC SRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs 5962-9559512HXC
WS128K32V-20G2UMA SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, CERAMIC, QFP-68 Microsemi Corporation WS128K32V-25G2UI vs WS128K32V-20G2UMA
PUMA68S4000ALM-020 SRAM Module, 512KX8, 20ns, CMOS, PQCC68 Mosaic Semiconductor Inc WS128K32V-25G2UI vs PUMA68S4000ALM-020

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