Part Details for WS128K32N-35H1M by White Electronic Designs Corp
Overview of WS128K32N-35H1M by White Electronic Designs Corp
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Part Details for WS128K32N-35H1M
WS128K32N-35H1M CAD Models
WS128K32N-35H1M Part Data Attributes
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WS128K32N-35H1M
White Electronic Designs Corp
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WS128K32N-35H1M
White Electronic Designs Corp
SRAM Module, 128KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 35 ns | |
Additional Feature | USER CONFIGURABLE AS 512K X 8 | |
I/O Type | COMMON | |
JESD-30 Code | S-CPGA-P66 | |
JESD-609 Code | e4 | |
Length | 27.3 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Terminals | 66 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 128KX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA66,11X11 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.6 mm | |
Standby Current-Max | 0.06 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.5 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | GOLD | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 27.3 mm |