Part Details for WMF512K8-70CM5A by Microsemi Corporation
Overview of WMF512K8-70CM5A by Microsemi Corporation
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for WMF512K8-70CM5A
WMF512K8-70CM5A CAD Models
WMF512K8-70CM5A Part Data Attributes
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WMF512K8-70CM5A
Microsemi Corporation
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Datasheet
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WMF512K8-70CM5A
Microsemi Corporation
Flash, 512KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SDIP-32
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, HERMETIC SEALED, CERAMIC, SDIP-32 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Microsemi Corporation | |
Access Time-Max | 70 ns | |
Additional Feature | SECTOR ERASE; 10000 ERASE/PROGRAM CYCLES MIN | |
JESD-30 Code | R-CDIP-T32 | |
Length | 42.4 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 512KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.13 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 15.24 mm |