Part Details for WEDPN8M72VR-66BI by Microsemi Corporation
Overview of WEDPN8M72VR-66BI by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Part Details for WEDPN8M72VR-66BI
WEDPN8M72VR-66BI CAD Models
WEDPN8M72VR-66BI Part Data Attributes
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WEDPN8M72VR-66BI
Microsemi Corporation
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Datasheet
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WEDPN8M72VR-66BI
Microsemi Corporation
Synchronous DRAM Module, 8MX72, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 219 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 7.5 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B219 | |
| Memory Density | 603979776 bit | |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | |
| Memory Width | 72 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 219 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX72 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for WEDPN8M72VR-66BI
This table gives cross-reference parts and alternative options found for WEDPN8M72VR-66BI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WEDPN8M72VR-66BI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WEDPN8M72V-100BM | Synchronous DRAM Module, 8MX72, 7ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPN8M72V-100BM |
| WEDPN8M72VR-66C | Synchronous DRAM Module, 8MX72, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPN8M72VR-66C |
| WEDPND8M72S-200BC | DDR DRAM Module, 8MX72, 0.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPND8M72S-200BC |
| WEDPN8M72V-125B2I | Synchronous DRAM, 8MX72, 6ns, CMOS, PBGA219, 21 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPN8M72V-125B2I |
| WEDPND8M72S-250BC | DDR DRAM Module, 8MX72, 0.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPND8M72S-250BC |
| WEDPN8M72V-100BI | Synchronous DRAM Module, 8MX72, 7ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPN8M72V-100BI |
| WEDPND8M72S-266BI | DDR DRAM Module, 8MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPND8M72S-266BI |
| WEDPN8M72V-100B2I | Synchronous DRAM, 8MX72, 7ns, CMOS, PBGA219, 21 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPN8M72V-100B2I |
| WEDPND8M72S-200BM | DDR DRAM Module, 8MX72, 0.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPND8M72S-200BM |
| WEDPN8M72V-100B2M | Synchronous DRAM, 8MX72, 7ns, CMOS, PBGA219, 21 X 25 MM, PLASTIC, BGA-219 | Microsemi Corporation | WEDPN8M72VR-66BI vs WEDPN8M72V-100B2M |