Part Details for WEDF1M32B-70G2UC5 by Microsemi Corporation
Overview of WEDF1M32B-70G2UC5 by Microsemi Corporation
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Part Details for WEDF1M32B-70G2UC5
WEDF1M32B-70G2UC5 CAD Models
WEDF1M32B-70G2UC5 Part Data Attributes
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WEDF1M32B-70G2UC5
Microsemi Corporation
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WEDF1M32B-70G2UC5
Microsemi Corporation
Flash Module, 1MX32, 70ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | QFP | |
| Package Description | 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68 | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 70 ns | |
| Additional Feature | USER CONFIGURABLE AS 4M X 8 | |
| Alternate Memory Width | 16 | |
| Boot Block | BOTTOM | |
| JESD-30 Code | S-CQFP-G68 | |
| JESD-609 Code | e4 | |
| Length | 22.36 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | FLASH MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.57 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Type | NOR TYPE | |
| Width | 22.36 mm |