Part Details for WED3DG6435V75D2 by Microsemi Corporation
Overview of WED3DG6435V75D2 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
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Aerospace and Defense
Energy and Power Systems
Part Details for WED3DG6435V75D2
WED3DG6435V75D2 CAD Models
WED3DG6435V75D2 Part Data Attributes
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WED3DG6435V75D2
Microsemi Corporation
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Datasheet
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WED3DG6435V75D2
Microsemi Corporation
Synchronous DRAM Module, 32MX64, CMOS, DIMM-168
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | DIMM | |
Package Description | , | |
Pin Count | 168 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | FOUR BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-XDMA-N168 | |
Memory Density | 2147483648 bit | |
Memory IC Type | SYNCHRONOUS DRAM MODULE | |
Memory Width | 64 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 168 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32MX64 | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for WED3DG6435V75D2
This table gives cross-reference parts and alternative options found for WED3DG6435V75D2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WED3DG6435V75D2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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THMY25N01A80L | IC 32M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168, DIMM-168, Dynamic RAM | Toshiba America Electronic Components | WED3DG6435V75D2 vs THMY25N01A80L |
HYM72V32656BT8-S | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | WED3DG6435V75D2 vs HYM72V32656BT8-S |
WED3DG6432V10D2I | Synchronous DRAM Module, 32MX64, CMOS, DIMM-168 | Microsemi Corporation | WED3DG6435V75D2 vs WED3DG6432V10D2I |
HYM71V32655HCLT8-P | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | WED3DG6435V75D2 vs HYM71V32655HCLT8-P |
MH32S64PHH-6L | Synchronous DRAM Module, 32354432X64, 5.4ns, CMOS, DIMM-168 | Mitsubishi Electric | WED3DG6435V75D2 vs MH32S64PHH-6L |
W3DG6334V75D2 | Synchronous DRAM Module, 32MX64, CMOS, DIMM-168 | Microsemi Corporation | WED3DG6435V75D2 vs W3DG6334V75D2 |
HYM71V32635AT8M-K | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 | SK Hynix Inc | WED3DG6435V75D2 vs HYM71V32635AT8M-K |
M366S3323ITS-C7A | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 | Samsung Semiconductor | WED3DG6435V75D2 vs M366S3323ITS-C7A |
M366S3253CTS-C7C | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 | Samsung Semiconductor | WED3DG6435V75D2 vs M366S3253CTS-C7C |
M366S3323CT0-C7A | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | Samsung Semiconductor | WED3DG6435V75D2 vs M366S3323CT0-C7A |