Part Details for WED3DG6419V10D2 by White Electronic Designs Corp
Overview of WED3DG6419V10D2 by White Electronic Designs Corp
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Part Details for WED3DG6419V10D2
WED3DG6419V10D2 CAD Models
WED3DG6419V10D2 Part Data Attributes
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WED3DG6419V10D2
White Electronic Designs Corp
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Datasheet
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WED3DG6419V10D2
White Electronic Designs Corp
Synchronous DRAM Module, 16MX64, CMOS, DIMM-168
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | DIMM, DIMM168 | |
Reach Compliance Code | unknown | |
Access Mode | FOUR BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 100 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-N168 | |
Memory Density | 1073741824 bit | |
Memory IC Type | SYNCHRONOUS DRAM MODULE | |
Memory Width | 64 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 168 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16MX64 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | DIMM168 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Refresh Cycles | 4096 | |
Self Refresh | YES | |
Standby Current-Max | 0.035 A | |
Supply Current-Max | 1.76 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |