Part Details for WED3C755E8MF-300BI by Microsemi Corporation
Overview of WED3C755E8MF-300BI by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Renewable Energy
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| TMP300BIDBVT | Texas Instruments | Resistor-Programmable, up to 18V-Capable Temp Switch and Analog Out Sensor 6-SOT-23 -40 to 125 | |
| TMP300BIDBVR | Texas Instruments | Resistor-Programmable, up to 18V-Capable Temp Switch and Analog Out Sensor 6-SOT-23 -40 to 125 | |
| TMP300BIDCKR | Texas Instruments | Resistor-Programmable, up to 18V-Capable Temp Switch and Analog Out Sensor 6-SC70 -40 to 125 |
Part Details for WED3C755E8MF-300BI
WED3C755E8MF-300BI CAD Models
WED3C755E8MF-300BI Part Data Attributes
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WED3C755E8MF-300BI
Microsemi Corporation
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Datasheet
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WED3C755E8MF-300BI
Microsemi Corporation
RISC Microprocessor, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 255 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 66 MHz | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | R-CBGA-B255 | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.85 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for WED3C755E8MF-300BI
This table gives cross-reference parts and alternative options found for WED3C755E8MF-300BI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WED3C755E8MF-300BI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TS(X)PC603RVGU/T6L(C) | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 | Thales Group | WED3C755E8MF-300BI vs TS(X)PC603RVGU/T6L(C) |
| PCX740PVGU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | WED3C755E8MF-300BI vs PCX740PVGU300LE |
| TSPC740AMGSB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | WED3C755E8MF-300BI vs TSPC740AMGSB/T12LE |
| WEDMC64603RV200CM | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 | Microsemi Corporation | WED3C755E8MF-300BI vs WEDMC64603RV200CM |
| TSPC740AVGU/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | WED3C755E8MF-300BI vs TSPC740AVGU/T10LH |
| TSPC740AVGB/Q10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | WED3C755E8MF-300BI vs TSPC740AVGB/Q10LE |
| WED3C755E8M-350BC | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | White Electronic Designs Corp | WED3C755E8MF-300BI vs WED3C755E8M-350BC |
| PCX745BMZFU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | Teledyne e2v | WED3C755E8MF-300BI vs PCX745BMZFU350LE |
| TSXPC740AVG12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | WED3C755E8MF-300BI vs TSXPC740AVG12LE |
| PCX745MZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | Teledyne e2v | WED3C755E8MF-300BI vs PCX745MZFU300LE |