Part Details for WED2DL32512V38BI by White Electronic Designs Corp
Overview of WED2DL32512V38BI by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WED2DL32512V38BI
WED2DL32512V38BI CAD Models
WED2DL32512V38BI Part Data Attributes
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WED2DL32512V38BI
White Electronic Designs Corp
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Datasheet
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WED2DL32512V38BI
White Electronic Designs Corp
SRAM Module, 512KX32, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | PLASTIC, BGA-119 | |
Reach Compliance Code | unknown | |
Category CO2 Kg | 12 | |
Compliance Temperature Grade | Industrial: -40C to +85C | |
Access Time-Max | 3.8 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e4 | |
Length | 22 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA119,7X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.794 mm | |
Standby Current-Max | 0.02 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.74 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | GOLD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for WED2DL32512V38BI
This table gives cross-reference parts and alternative options found for WED2DL32512V38BI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WED2DL32512V38BI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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WED2DL32512V40BI | SRAM Module, 512KX32, 4ns, CMOS, PBGA119, PLASTIC, BGA-119 | White Electronic Designs Corp | WED2DL32512V38BI vs WED2DL32512V40BI |
AS7C33512PFD32A-133BI | Standard SRAM, 512KX32, 3.8ns, CMOS, PBGA165, BGA-165 | Alliance Semiconductor Corporation | WED2DL32512V38BI vs AS7C33512PFD32A-133BI |