Part Details for WE256K8150CIA by Microsemi Corporation
Overview of WE256K8150CIA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WE256K8150CIA
WE256K8150CIA CAD Models
WE256K8150CIA Part Data Attributes
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WE256K8150CIA
Microsemi Corporation
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Datasheet
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WE256K8150CIA
Microsemi Corporation
EEPROM Module, 256KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.1.B.1 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 150 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 40.6 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for WE256K8150CIA
This table gives cross-reference parts and alternative options found for WE256K8150CIA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE256K8150CIA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9315502HYA | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, | White Microelectronics | WE256K8150CIA vs 5962-9315502HYA |
| 5962-9315502HYC | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, | White Microelectronics | WE256K8150CIA vs 5962-9315502HYC |
| WE256K8150CCA | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE256K8150CIA vs WE256K8150CCA |
| WE256K8150CC | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE256K8150CIA vs WE256K8150CC |
| 5962-9315502HYX | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, BOTTOM BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE256K8150CIA vs 5962-9315502HYX |
| 5962-9323502MXX | EEPROM, 256KX8, 150ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Rochester Electronics LLC | WE256K8150CIA vs 5962-9323502MXX |
| WE256K8150CQ | 256KX8 EEPROM 5V MODULE, 150ns, CDIP32, HERMETIC SEALED, BOTTOM BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE256K8150CIA vs WE256K8150CQ |
| 5962-9315502HYA | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, | Mercury Systems Inc | WE256K8150CIA vs 5962-9315502HYA |
| 5962-9315502HYA | EEPROM Module, 256KX8, 150ns, Parallel, CMOS, | Microsemi Corporation | WE256K8150CIA vs 5962-9315502HYA |
| 5962-9323502MXX | EEPROM, 256KX8, 150ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 | Intel Corporation | WE256K8150CIA vs 5962-9323502MXX |