Part Details for WE256K32-300G2TMEA by Microsemi Corporation
Overview of WE256K32-300G2TMEA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WE256K32-300G2TMEA
WE256K32-300G2TMEA CAD Models
WE256K32-300G2TMEA Part Data Attributes
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WE256K32-300G2TMEA
Microsemi Corporation
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Datasheet
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WE256K32-300G2TMEA
Microsemi Corporation
EEPROM Module, 256KX32, 300ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 68 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 300 ns | |
| Additional Feature | USER CONFIGURABLE 256K X 32; MINIMUM 10 YEARS DATA RETENTION; WRITE ENDURANCE 10000 CYCLES | |
| Data Retention Time-Min | 10 | |
| Endurance | 10000 Write/Erase Cycles | |
| JESD-30 Code | S-CQFP-G68 | |
| Length | 22.36 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256KX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.57 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 22.36 mm |
Alternate Parts for WE256K32-300G2TMEA
This table gives cross-reference parts and alternative options found for WE256K32-300G2TMEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE256K32-300G2TMEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WE256K32-300G2TIE | EEPROM Module, 256KX32, 300ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Microsemi Corporation | WE256K32-300G2TMEA vs WE256K32-300G2TIE |
| WE256K32-300G2TME | EEPROM Module, 256KX32, 300ns, Parallel, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Microsemi Corporation | WE256K32-300G2TMEA vs WE256K32-300G2TME |