Part Details for WE128K32P300H1IA by White Electronic Designs Corp
Overview of WE128K32P300H1IA by White Electronic Designs Corp
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Part Details for WE128K32P300H1IA
WE128K32P300H1IA CAD Models
WE128K32P300H1IA Part Data Attributes
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WE128K32P300H1IA
White Electronic Designs Corp
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WE128K32P300H1IA
White Electronic Designs Corp
EEPROM Module, 128KX32, 300ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.1.B.1 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 300 ns | |
| Additional Feature | ALSO CONFIGURABLE AS 512K X 8 | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | S-CPGA-P66 | |
| Length | 27.3 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX32 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.6 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.3 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |