Part Details for W742C810 by Winbond Electronics Corp
Overview of W742C810 by Winbond Electronics Corp
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Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Smart Cities
Electronic Manufacturing
Part Details for W742C810
W742C810 CAD Models
W742C810 Part Data Attributes
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W742C810
Winbond Electronics Corp
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W742C810
Winbond Electronics Corp
Microcontroller, 4-Bit, MROM, 3.58MHz, CMOS, PQFP100, 14 X 20 MM, 2.75 MM HEIGHT, QFP-100
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Part Package Code | QFP | |
Package Description | 14 X 20 MM, 2.75 MM HEIGHT, QFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Additional Feature | BUILT IN LCD DRIVER | |
Address Bus Width | ||
Bit Size | 4 | |
Boundary Scan | NO | |
Clock Frequency-Max | 3.58 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e0 | |
Length | 20 mm | |
Number of I/O Lines | 20 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP100,.75X.99 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
RAM (bytes) | 532 | |
ROM (words) | 8192 | |
ROM Programmability | MROM | |
Seated Height-Max | 3.32 mm | |
Speed | 3.58 MHz | |
Supply Current-Max | 1 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |