There are no models available for this part yet.
Overview of W631GG6MB11I by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 2 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 7 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for W631GG6MB11I by Winbond Electronics Corp
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| NAC | 1Gb DDR3 SDRAM, x16, Industrial Temp. 933MHz, WBGA96 Package RoHS: Compliant Min Qty: 198 Package Multiple: 198 | 0 |
|
$4.4700 / $4.7100 | Buy Now |
CAD Models for W631GG6MB11I by Winbond Electronics Corp
Part Data Attributes for W631GG6MB11I by Winbond Electronics Corp
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
|
Package Description
|
VFBGA-96
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.32
|
|
Date Of Intro
|
2017-12-01
|
|
Samacsys Manufacturer
|
Winbond
|
|
Access Mode
|
MULTI BANK PAGE BURST
|
|
Additional Feature
|
AUTO/SELF REFRESH
|
|
JESD-30 Code
|
R-PBGA-B96
|
|
Length
|
13 mm
|
|
Memory Density
|
1073741824 bit
|
|
Memory IC Type
|
DDR DRAM
|
|
Memory Width
|
16
|
|
Number of Functions
|
1
|
|
Number of Ports
|
1
|
|
Number of Terminals
|
96
|
|
Number of Words
|
67108864 words
|
|
Number of Words Code
|
64000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
95 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
64MX16
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
VFBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Seated Height-Max
|
1 mm
|
|
Self Refresh
|
YES
|
|
Supply Voltage-Max (Vsup)
|
1.575 V
|
|
Supply Voltage-Min (Vsup)
|
1.425 V
|
|
Supply Voltage-Nom (Vsup)
|
1.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
7.5 mm
|
Alternate Parts for W631GG6MB11I
This table gives cross-reference parts and alternative options found for W631GG6MB11I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W631GG6MB11I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W631GG6KB-11 | DDR DRAM, 64MX16, 0.195ns, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W631GG6MB11I vs W631GG6KB-11 |
| W631GG6MB-11 | DDR DRAM, | Winbond Electronics Corp | W631GG6MB11I vs W631GG6MB-11 |