Part Details for W3J512M32G-1600B3M by Mercury Systems Inc
Overview of W3J512M32G-1600B3M by Mercury Systems Inc
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Applications
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Consumer Electronics
Computing and Data Storage
Part Details for W3J512M32G-1600B3M
W3J512M32G-1600B3M CAD Models
W3J512M32G-1600B3M Part Data Attributes
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W3J512M32G-1600B3M
Mercury Systems Inc
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W3J512M32G-1600B3M
Mercury Systems Inc
DDR DRAM, 512MX32, CMOS, PBGA136, BGA-136
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MERCURY SYSTEMS INC | |
| Package Description | BGA, BGA136(UNSPEC) | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | SINGLE BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B136 | |
| Memory Density | 17179869184 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 136 | |
| Number of Words | 536870912 words | |
| Number of Words Code | 512000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA136(UNSPEC) | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Reverse Pinout | NO | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM |