Datasheets
W3E64M16S-333SBC by:

DDR DRAM, 64MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, BGA-60

Part Details for W3E64M16S-333SBC by White Electronic Designs Corp

Overview of W3E64M16S-333SBC by White Electronic Designs Corp

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Applications Consumer Electronics Computing and Data Storage

Part Details for W3E64M16S-333SBC

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W3E64M16S-333SBC Part Data Attributes

W3E64M16S-333SBC White Electronic Designs Corp
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W3E64M16S-333SBC White Electronic Designs Corp DDR DRAM, 64MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, BGA-60
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP
Package Description BGA, BGA60,9X12,40/32
Reach Compliance Code unknown
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B60
Length 12.5 mm
Memory Density 1073741824 bit
Memory IC Type DDR1 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 2.56 mm
Self Refresh YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.01 A
Supply Current-Max 0.81 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10 mm

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