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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W25Q64JVTCJQ-ND
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DigiKey | IC FLASH 64MBIT SPI/QUAD 24TFBGA Lead time: 28 Weeks Container: Tube | Temporarily Out of Stock |
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W25Q64JVTCJQ
Winbond Electronics Corp
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Datasheet
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W25Q64JVTCJQ
Winbond Electronics Corp
Flash,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | TBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2018-04-03 | |
Samacsys Manufacturer | Winbond | |
Additional Feature | IT ALSO OPERATES AT 2.7V @ 104MHZ | |
Alternate Memory Width | 1 | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,4X6,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 3 V | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.02 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Protection | HARDWARE/SOFTWARE |
This table gives cross-reference parts and alternative options found for W25Q64JVTCJQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q64JVTCJQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
M25PX64SOVZM3EB | Flash, 8MX8, PBGA24, 6 X 8 MM, ROHS COMPLIANT, TBGA-24 | Micron Technology Inc | W25Q64JVTCJQ vs M25PX64SOVZM3EB |
M25P64-VMF3TPB | Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | Micron Technology Inc | W25Q64JVTCJQ vs M25P64-VMF3TPB |
M25PX64SOVMF6E | Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | Numonyx Memory Solutions | W25Q64JVTCJQ vs M25PX64SOVMF6E |
M25PX64STVZM3T | Flash, 8MX8, PBGA24, 6 X 8 MM, ROHS COMPLIANT, TBGA-24 | Micron Technology Inc | W25Q64JVTCJQ vs M25PX64STVZM3T |
M25PX64SOVZM3E | Flash, 8MX8, PBGA24, 6 X 8 MM, ROHS COMPLIANT, TBGA-24 | Micron Technology Inc | W25Q64JVTCJQ vs M25PX64SOVZM3E |
M25PX64STVMF3EB | Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 | Micron Technology Inc | W25Q64JVTCJQ vs M25PX64STVMF3EB |
M25PX64-VMD3E | Flash, 8MX8, PDSO8, 8 X 6 MM, ROHS COMPLIANT, VDFP-8 | Micron Technology Inc | W25Q64JVTCJQ vs M25PX64-VMD3E |
M25P64-VMF3PB | Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | Micron Technology Inc | W25Q64JVTCJQ vs M25P64-VMF3PB |
M25PX64SVMF6TG | EEPROM, 8MX8, Serial, CMOS, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | Numonyx Memory Solutions | W25Q64JVTCJQ vs M25PX64SVMF6TG |
W25Q64JVSSIQT | Flash, 8MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q64JVTCJQ vs W25Q64JVSSIQT |