Datasheets
W24L04T-70LE by: Winbond Electronics Corp

Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32

Part Details for W24L04T-70LE by Winbond Electronics Corp

Overview of W24L04T-70LE by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Available Datasheets

Part # Manufacturer Description Datasheet
2SK3070L-E Renesas Electronics Corporation Nch Single Power Mosfet 40V 75A 5.8Mohm LDPAK(L)/To-262

Part Details for W24L04T-70LE

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W24L04T-70LE Part Data Attributes

W24L04T-70LE Winbond Electronics Corp
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W24L04T-70LE Winbond Electronics Corp Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code TSOP1
Package Description TSOP1,
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Category CO2 Kg 12
Compliance Temperature Grade Commercial Extended: -20C to +85C
Access Time-Max 70 ns
JESD-30 Code R-PDSO-G32
JESD-609 Code e3
Length 18.4 mm
Memory Density 4194304 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Organization 512KX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Width 8 mm

Alternate Parts for W24L04T-70LE

This table gives cross-reference parts and alternative options found for W24L04T-70LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W24L04T-70LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
V62C2804096LL-70T Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, TSOP-32 Mosel Vitelic Corporation W24L04T-70LE vs V62C2804096LL-70T
HY62U8400ALLT2-70E Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 SK Hynix Inc W24L04T-70LE vs HY62U8400ALLT2-70E
W24L04T-70LI Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Winbond Electronics Corp W24L04T-70LE vs W24L04T-70LI
HY62V8400ALLT2-70E Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 SK Hynix Inc W24L04T-70LE vs HY62V8400ALLT2-70E
HY62U8400AP-70I Standard SRAM, 512KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 SK Hynix Inc W24L04T-70LE vs HY62U8400AP-70I
MX66V4000TC Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32 Macronix International Co Ltd W24L04T-70LE vs MX66V4000TC
K6T4008V1B-MB700 Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.400 INCH, REVERSE, TSOP2-32 Samsung Semiconductor W24L04T-70LE vs K6T4008V1B-MB700
MX66V4000TRC Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, REVERSE, TSOP-32 Macronix International Co Ltd W24L04T-70LE vs MX66V4000TRC
PDM31096LL70TTY Standard SRAM, 512KX8, 70ns, CMOS, PDSO32 Paradigm Technology Inc W24L04T-70LE vs PDM31096LL70TTY
HY62U8400ALT2-70I Standard SRAM, 512KX8, 70ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 SK Hynix Inc W24L04T-70LE vs HY62U8400ALT2-70I

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