Datasheets
VR4CU326428DTH by: Viking Technology

DDR DRAM Module, 32MX64, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184

Part Details for VR4CU326428DTH by Viking Technology

Overview of VR4CU326428DTH by Viking Technology

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for VR4CU326428DTH

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VR4CU326428DTH Part Data Attributes

VR4CU326428DTH Viking Technology
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VR4CU326428DTH Viking Technology DDR DRAM Module, 32MX64, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer VIKING TECHNOLOGY
Part Package Code DIMM
Package Description DIMM,
Pin Count 184
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
JESD-30 Code R-XDMA-N184
Length 133.35 mm
Memory Density 2147483648 bit
Memory IC Type DDR DRAM MODULE
Memory Width 64
Number of Functions 1
Number of Ports 1
Number of Terminals 184
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX64
Package Body Material UNSPECIFIED
Package Code DIMM
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 31.75 mm
Self Refresh YES
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.81 mm

Alternate Parts for VR4CU326428DTH

This table gives cross-reference parts and alternative options found for VR4CU326428DTH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of VR4CU326428DTH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYMD232M646C6-H DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 SK Hynix Inc VR4CU326428DTH vs HYMD232M646C6-H
W3EG6433S262JD3 DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 Microsemi Corporation VR4CU326428DTH vs W3EG6433S262JD3
M368L3313BT1-CB0 DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor VR4CU326428DTH vs M368L3313BT1-CB0
HYMD232M646CLF6-L DDR DRAM Module, 32MX64, 0.8ns, CMOS, SODIMM-200 SK Hynix Inc VR4CU326428DTH vs HYMD232M646CLF6-L
HYMD532M646L6-H DDR DRAM Module, 32MX64, 0.75ns, CMOS, 67.60 X 31.75 X 3.80 MM, SODIMM-200 SK Hynix Inc VR4CU326428DTH vs HYMD532M646L6-H
M368L3313BT0-CA0 DDR DRAM Module, 32MX64, 0.8ns, CMOS, UDIMM-184 Samsung Semiconductor VR4CU326428DTH vs M368L3313BT0-CA0
MT8VDDT3264HG-202XX DDR DRAM Module, 32MX64, 0.8ns, CMOS, MO-224, SODIMM-200 Micron Technology Inc VR4CU326428DTH vs MT8VDDT3264HG-202XX
W3EG6432S263D3 DDR DRAM Module, 32MX64, 0.75ns, CMOS, DIMM-184 Microsemi Corporation VR4CU326428DTH vs W3EG6432S263D3
W3EG6432S265D4IF DDR DRAM Module, 32MX64, 0.75ns, CMOS, LEAD FREE, SO-DIMM-200 Microsemi Corporation VR4CU326428DTH vs W3EG6432S265D4IF
MT8VDDT3264HDG-262XX DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 Micron Technology Inc VR4CU326428DTH vs MT8VDDT3264HDG-262XX

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