Part Details for V59C1G01808QCLP25H by ProMOS Technologies Inc
Overview of V59C1G01808QCLP25H by ProMOS Technologies Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for V59C1G01808QCLP25H
V59C1G01808QCLP25H CAD Models
V59C1G01808QCLP25H Part Data Attributes
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V59C1G01808QCLP25H
ProMOS Technologies Inc
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Datasheet
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V59C1G01808QCLP25H
ProMOS Technologies Inc
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, DIE STACKED FBGA-60
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | PROMOS TECHNOLOGIES INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 60 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 10 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA60,9X11,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.009 A | |
| Supply Current-Max | 0.195 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
Alternate Parts for V59C1G01808QCLP25H
This table gives cross-reference parts and alternative options found for V59C1G01808QCLP25H. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of V59C1G01808QCLP25H, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| V59C1G01808QCLP25I | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, DIE STACKED FBGA-60 | ProMOS Technologies Inc | V59C1G01808QCLP25H vs V59C1G01808QCLP25I |
| V59C1G01808QCLP25AI | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, DIE STACKED FBGA-60 | ProMOS Technologies Inc | V59C1G01808QCLP25H vs V59C1G01808QCLP25AI |
| V59C1G01808QCLP25A | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, DIE STACKED FBGA-60 | ProMOS Technologies Inc | V59C1G01808QCLP25H vs V59C1G01808QCLP25A |
| V59C1G01808QCLP25 | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, DIE STACKED FBGA-60 | ProMOS Technologies Inc | V59C1G01808QCLP25H vs V59C1G01808QCLP25 |