Part Details for UPD703106AF1-XXX-EN4-A by Renesas Electronics Corporation
Overview of UPD703106AF1-XXX-EN4-A by Renesas Electronics Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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UPD703106AF1-XXX-EN4-A | Renesas Electronics Corporation | 32-bit Microcontrollers (Non Promotion), LFBGA, / |
Part Details for UPD703106AF1-XXX-EN4-A
UPD703106AF1-XXX-EN4-A CAD Models
UPD703106AF1-XXX-EN4-A Part Data Attributes
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UPD703106AF1-XXX-EN4-A
Renesas Electronics Corporation
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Datasheet
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UPD703106AF1-XXX-EN4-A
Renesas Electronics Corporation
32-bit Microcontrollers (Non Promotion), LFBGA, /
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LFBGA | |
Pin Count | 161 | |
Manufacturer Package Code | PLBG0161GA | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Bit Size | 32 | |
CPU Family | V850 | |
JESD-30 Code | S-PBGA-B161 | |
JESD-609 Code | e6 | |
Number of Terminals | 161 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA161,14X14,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 10240 | |
ROM (words) | 131072 | |
ROM Programmability | MROM | |
Speed | 50 MHz | |
Supply Current-Max | 240 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN BISMUTH | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |