Part Details for UM9608 by Microsemi Corporation
Overview of UM9608 by Microsemi Corporation
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Applications
Consumer Electronics
Education and Research
Industrial Automation
Electronic Manufacturing
Part Details for UM9608
UM9608 CAD Models
UM9608 Part Data Attributes:
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UM9608
Microsemi Corporation
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UM9608
Microsemi Corporation
Pin Diode, 400V V(BR), Silicon, HERMETIC SEALED, GLASS PACKAGE-2
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | HERMETIC SEALED, GLASS PACKAGE-2 | |
| Pin Count | 2 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Additional Feature | HIGH RELIABILITY | |
| Application | SWITCHING | |
| Breakdown Voltage-Min | 400 V | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.5 pF | |
| Diode Capacitance-Nom | 1.2 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 1.7 Ω | |
| Diode Res Test Current | 100 mA | |
| Diode Res Test Frequency | 100 MHz | |
| Diode Type | PIN DIODE | |
| Frequency Band | ULTRA HIGH FREQUENCY TO S BAND | |
| JESD-30 Code | O-LEMW-N2 | |
| Minority Carrier Lifetime-Nom | 2 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -65 °C | |
| Package Body Material | GLASS | |
| Package Shape | ROUND | |
| Package Style | MICROWAVE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Dissipation-Max | 0.5 W | |
| Qualification Status | Not Qualified | |
| Reverse Test Voltage | 100 V | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | END | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |