Part Details for UM7306DR by Microsemi Corporation
Overview of UM7306DR by Microsemi Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Part Details for UM7306DR
UM7306DR CAD Models
UM7306DR Part Data Attributes
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UM7306DR
Microsemi Corporation
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UM7306DR
Microsemi Corporation
Pin Diode, 600V V(BR), Silicon,
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Additional Feature | LOW DISTORTION | |
| Application | ATTENUATOR | |
| Breakdown Voltage-Min | 600 V | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.7 pF | |
| Diode Capacitance-Nom | 0.7 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 3 Ω | |
| Diode Res Test Current | 100 mA | |
| Diode Res Test Frequency | 150 MHz | |
| Diode Type | PIN DIODE | |
| Frequency Band | HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | |
| JESD-30 Code | O-XRPM-F2 | |
| Minority Carrier Lifetime-Nom | 4 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 175 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | ROUND | |
| Package Style | POST/STUD MOUNT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Dissipation-Max | 6 W | |
| Qualification Status | Not Qualified | |
| Reverse Test Voltage | 100 V | |
| Surface Mount | NO | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | FLAT | |
| Terminal Position | RADIAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |