There are no models available for this part yet.
Overview of TSXPC860MHVZPU50B by Atmel Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Industrial Automation
Aerospace and Defense
Agriculture Technology
Robotics and Drones
CAD Models for TSXPC860MHVZPU50B by Atmel Corporation
Part Data Attributes for TSXPC860MHVZPU50B by Atmel Corporation
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
ATMEL CORP
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|
Part Package Code
|
BGA
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|
Package Description
|
BGA, BGA357,19X19,50
|
|
Pin Count
|
357
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.A.2
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|
HTS Code
|
8542.31.00.01
|
|
Address Bus Width
|
32
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Bit Size
|
32
|
|
Boundary Scan
|
YES
|
|
Clock Frequency-Max
|
50 MHz
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|
External Data Bus Width
|
32
|
|
Format
|
FIXED POINT
|
|
Integrated Cache
|
YES
|
|
JESD-30 Code
|
S-PBGA-B357
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|
JESD-609 Code
|
e0
|
|
Length
|
25 mm
|
|
Low Power Mode
|
YES
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|
Number of Terminals
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357
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|
Operating Temperature-Max
|
110 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA357,19X19,50
|
|
Package Shape
|
SQUARE
|
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Package Style
|
GRID ARRAY
|
|
Qualification Status
|
Not Qualified
|
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Seated Height-Max
|
2.05 mm
|
|
Speed
|
50 MHz
|
|
Supply Voltage-Max
|
3.465 V
|
|
Supply Voltage-Min
|
3.135 V
|
|
Supply Voltage-Nom
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
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Width
|
25 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
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Alternate Parts for TSXPC860MHVZPU50B
This table gives cross-reference parts and alternative options found for TSXPC860MHVZPU50B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC860MHVZPU50B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC860SRMZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSXPC860MHVZPU50B vs TSPC860SRMZPU50B |
| XPC860DTZP50D3 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | TSXPC860MHVZPU50B vs XPC860DTZP50D3 |
| XPC860DPZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSXPC860MHVZPU50B vs XPC860DPZP50D4 |
| XPC857TZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | TSXPC860MHVZPU50B vs XPC857TZP50B |
| TSPC860SRMZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSXPC860MHVZPU50B vs TSPC860SRMZPU50B |
| MPC860DECZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | TSXPC860MHVZPU50B vs MPC860DECZQ50D4 |
| XPC862TZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSXPC860MHVZPU50B vs XPC862TZP50B |
| XPC860TZP50D3 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | TSXPC860MHVZPU50B vs XPC860TZP50D3 |
| XPC860DPZP50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSXPC860MHVZPU50B vs XPC860DPZP50D4R2 |
| KMPC860SRZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | TSXPC860MHVZPU50B vs KMPC860SRZQ50D4 |