Datasheets
TSXPC750AMGSU12LH by: Atmel Corporation

RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for TSXPC750AMGSU12LH by Atmel Corporation

Overview of TSXPC750AMGSU12LH by Atmel Corporation

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Applications Industrial Automation

Part Details for TSXPC750AMGSU12LH

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TSXPC750AMGSU12LH Part Data Attributes

TSXPC750AMGSU12LH Atmel Corporation
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TSXPC750AMGSU12LH Atmel Corporation RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code CGA
Package Description CGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-C360
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Speed 266 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form C BEND
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSXPC750AMGSU12LH

This table gives cross-reference parts and alternative options found for TSXPC750AMGSU12LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC750AMGSU12LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSPC750AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSXPC750AMGSU12LH vs TSPC750AVGS12LE
TSPC750AMGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU12LH vs TSPC750AMGS12LE
TSPC750AVGSU/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSU12LH vs TSPC750AVGSU/T12LH
TSXPC750AMGSB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU12LH vs TSXPC750AMGSB/Q12LE
TSPC750AVGSU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU12LH vs TSPC750AVGSU12LE
TSXPC750AVGS12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU12LH vs TSXPC750AVGS12LH
TSPC750AMGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSXPC750AMGSU12LH vs TSPC750AMGS12LE
TSXPC750AMGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU12LH vs TSXPC750AMGS12LE
TSXPC750AMGSU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU12LH vs TSXPC750AMGSU12LE
TSPC750AVGS12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSU12LH vs TSPC750AVGS12LH
Part Number Description Manufacturer Compare
TSXC750AMGU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSXPC750AMGSU12LH vs TSXC750AMGU/T8LH
MPC8541ECPXAPEX 32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 Freescale Semiconductor TSXPC750AMGSU12LH vs MPC8541ECPXAPEX
PCX7447AVGH1000NB RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v TSXPC750AMGSU12LH vs PCX7447AVGH1000NB
NHPXA270C0E416 RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360 Intel Corporation TSXPC750AMGSU12LH vs NHPXA270C0E416
TSPC750AVGU/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSXPC750AMGSU12LH vs TSPC750AVGU/T8LE
PC7447AVGHY1000NC RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 Atmel Corporation TSXPC750AMGSU12LH vs PC7447AVGHY1000NC
XPC755BRX300LE 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 Motorola Mobility LLC TSXPC750AMGSU12LH vs XPC755BRX300LE
PC755BVGU366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation TSXPC750AMGSU12LH vs PC755BVGU366LE
TSPC750AMGU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSXPC750AMGSU12LH vs TSPC750AMGU/T8LH
PCX7447VGU600LB RISC Microprocessor, 32-Bit, 600MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSXPC750AMGSU12LH vs PCX7447VGU600LB

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