Part Details for TSPC860SRMZP50D by e2v technologies
Overview of TSPC860SRMZP50D by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC860SRMZP50D
TSPC860SRMZP50D CAD Models
TSPC860SRMZP50D Part Data Attributes
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TSPC860SRMZP50D
e2v technologies
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Datasheet
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TSPC860SRMZP50D
e2v technologies
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 357 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC860SRMZP50D
This table gives cross-reference parts and alternative options found for TSPC860SRMZP50D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860SRMZP50D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC855TVR50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | TSPC860SRMZP50D vs MPC855TVR50D4R2 |
| MPC860PCVR50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | TSPC860SRMZP50D vs MPC860PCVR50D4 |
| MPC860SRZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | TSPC860SRMZP50D vs MPC860SRZQ50D4 |
| XPC860DECZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | TSPC860SRMZP50D vs XPC860DECZP50D4 |
| XPC860PCZP50D3 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | TSPC860SRMZP50D vs XPC860PCZP50D3 |
| XPC860PZP50D4 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | TSPC860SRMZP50D vs XPC860PZP50D4 |
| XPC860TCZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860SRMZP50D vs XPC860TCZP50D3 |
| TSPC860SRVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSPC860SRMZP50D vs TSPC860SRVZPU50C1 |
| XPC862PZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | TSPC860SRMZP50D vs XPC862PZP50B |
| TSPC860SRMZPU/T50D | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | e2v technologies | TSPC860SRMZP50D vs TSPC860SRMZPU/T50D |