Part Details for TSPC860MHVZPU/T50C by Teledyne e2v
Overview of TSPC860MHVZPU/T50C by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC860MHVZPU/T50C
TSPC860MHVZPU/T50C CAD Models
TSPC860MHVZPU/T50C Part Data Attributes
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TSPC860MHVZPU/T50C
Teledyne e2v
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Datasheet
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TSPC860MHVZPU/T50C
Teledyne e2v
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL GRENOBLE | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC860MHVZPU/T50C
This table gives cross-reference parts and alternative options found for TSPC860MHVZPU/T50C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860MHVZPU/T50C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC862TZP50 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHVZPU/T50C vs XPC862TZP50 |
| TSXPC860MHVZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVZPU/T50C vs TSXPC860MHVZPU50B |
| TSPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVZPU/T50C vs TSPC860MHVZPU50C1 |
| TSPC860MHVZPU50D4 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVZPU/T50C vs TSPC860MHVZPU50D4 |
| XPC860TZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHVZPU/T50C vs XPC860TZP50D3 |
| XPC855TZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | TSPC860MHVZPU/T50C vs XPC855TZP50D4 |
| TSXPC860MHMZP50C | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVZPU/T50C vs TSXPC860MHMZP50C |
| TSXPC860MHMZP50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVZPU/T50C vs TSXPC860MHMZP50B |
| KMPC860DEZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | TSPC860MHVZPU/T50C vs KMPC860DEZQ50D4 |
| XPC862TZP50B | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | TSPC860MHVZPU/T50C vs XPC862TZP50B |