Part Details for TSPC860MHVGU/T50B by Thales Group
Overview of TSPC860MHVGU/T50B by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC860MHVGU/T50B
TSPC860MHVGU/T50B CAD Models
TSPC860MHVGU/T50B Part Data Attributes
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TSPC860MHVGU/T50B
Thales Group
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Datasheet
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TSPC860MHVGU/T50B
Thales Group
Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B357 | |
| Low Power Mode | NO | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for TSPC860MHVGU/T50B
This table gives cross-reference parts and alternative options found for TSPC860MHVGU/T50B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860MHVGU/T50B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC860SRMZPU66D4 | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSPC860MHVGU/T50B vs TSXPC860SRMZPU66D4 |
| TS(X)PC860MHMZPU/T50C | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TSPC860MHVGU/T50B vs TS(X)PC860MHMZPU/T50C |
| TSPC860SRVZP40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSPC860MHVGU/T50B vs TSPC860SRVZP40D |
| TSPC860MHVZPB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TSPC860MHVGU/T50B vs TSPC860MHVZPB/Q40A3 |
| MPC880CVR133 | PowerQUICC, 32 Bit Power Architecture, 133MHz, Communications Processor, -40 to 100C | Freescale Semiconductor | TSPC860MHVGU/T50B vs MPC880CVR133 |
| TS(X)PC860MHMG40C | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TSPC860MHVGU/T50B vs TS(X)PC860MHMG40C |
| TS(X)PC860MHVZP50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TSPC860MHVGU/T50B vs TS(X)PC860MHVZP50B |
| MPC866PZP133 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHVGU/T50B vs MPC866PZP133 |
| TSPC860SRMZPU80B | RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSPC860MHVGU/T50B vs TSPC860SRMZPU80B |
| XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHVGU/T50B vs XPC860PZP50D3 |