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Overview of TSPC860MHVG40A3 by Teledyne e2v
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for TSPC860MHVG40A3 by Teledyne e2v
Part Data Attributes for TSPC860MHVG40A3 by Teledyne e2v
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
ATMEL GRENOBLE
|
Part Package Code
|
BGA
|
Package Description
|
,
|
Pin Count
|
357
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.A.2
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
32
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
40 MHz
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-CBGA-B357
|
Low Power Mode
|
NO
|
Number of Terminals
|
357
|
Operating Temperature-Max
|
110 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Qualification Status
|
Not Qualified
|
Speed
|
40 MHz
|
Supply Voltage-Max
|
3.465 V
|
Supply Voltage-Min
|
3.135 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Position
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR
|
Alternate Parts for TSPC860MHVG40A3
This table gives cross-reference parts and alternative options found for TSPC860MHVG40A3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860MHVG40A3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TSPC860MHMZPU40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSPC860MHMZPU40A3 |
TS(X)PC860MHVGB/Q50B | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TS(X)PC860MHVGB/Q50B |
TSPC860MHMZP50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSPC860MHMZP50A3 |
TSPC860MHVZPU/T40C | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSPC860MHVZPU/T40C |
TS(X)PC860MHMGU40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TS(X)PC860MHMGU40A3 |
TSPC860MHVZPB/Q40C | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSPC860MHVZPB/Q40C |
TS(X)PC860MHVGB/Q40C | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TS(X)PC860MHVGB/Q40C |
TSXPC860MHVZP40C | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSXPC860MHVZP40C |
TSPC860MHMZP40B | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSPC860MHMZP40B |
TSPC860MHMG40C | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | TSPC860MHVG40A3 vs TSPC860MHMG40C |