Part Details for TSPC860MHMGB/Q50B by Thales Group
Overview of TSPC860MHMGB/Q50B by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC860MHMGB/Q50B
TSPC860MHMGB/Q50B CAD Models
TSPC860MHMGB/Q50B Part Data Attributes
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TSPC860MHMGB/Q50B
Thales Group
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Datasheet
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TSPC860MHMGB/Q50B
Thales Group
Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B357 | |
| Low Power Mode | NO | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for TSPC860MHMGB/Q50B
This table gives cross-reference parts and alternative options found for TSPC860MHMGB/Q50B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860MHMGB/Q50B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TS(X)PC860MHMZPB/Q50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TSPC860MHMGB/Q50B vs TS(X)PC860MHMZPB/Q50A3 |
| XPC855TZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHMGB/Q50B vs XPC855TZP50D4 |
| TSPC860MHVZPB/Q40B | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TSPC860MHMGB/Q50B vs TSPC860MHVZPB/Q40B |
| TS(X)PC860MHVZPU50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHMGB/Q50B vs TS(X)PC860MHVZPU50B |
| TS(X)PC860MHMZPU/T40B | 32-BIT, 40MHz, MICROPROCESSOR, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHMGB/Q50B vs TS(X)PC860MHMZPU/T40B |
| MPC8241LVR266D | 32-BIT, 266MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, LEAD FREE, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHMGB/Q50B vs MPC8241LVR266D |
| TS(X)PC860MHVGU40B | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TSPC860MHMGB/Q50B vs TS(X)PC860MHVGU40B |
| MPC860DPZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | TSPC860MHMGB/Q50B vs MPC860DPZQ50D4 |
| TSPC860MHMZP50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TSPC860MHMGB/Q50B vs TSPC860MHMZP50B |
| TSPC860MHVZPU40D4 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSPC860MHMGB/Q50B vs TSPC860MHVZPU40D4 |