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Overview of TMS27C512-1JL4 by Rochester Electronics LLC
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Aerospace and Defense
Healthcare
CAD Models for TMS27C512-1JL4 by Rochester Electronics LLC
Part Data Attributes for TMS27C512-1JL4 by Rochester Electronics LLC
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Part Life Cycle Code
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Contact Manufacturer
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Ihs Manufacturer
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ROCHESTER ELECTRONICS LLC
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Package Description
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DIP,
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.61
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Access Time-Max
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170 ns
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JESD-30 Code
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R-CDIP-T28
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Length
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36.83 mm
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Memory Density
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524288 bit
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Memory IC Type
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UVPROM
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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28
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Number of Words
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65536 words
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Number of Words Code
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64000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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64KX8
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
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DIP
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
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PARALLEL
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Seated Height-Max
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4.907 mm
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Supply Current-Max
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0.00025 mA
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Supply Voltage-Max (Vsup)
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5.25 V
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Supply Voltage-Min (Vsup)
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4.75 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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Width
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15.24 mm
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