Datasheets
TMS27C32-10JL by: Texas Instruments

4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24

Part Details for TMS27C32-10JL by Texas Instruments

Overview of TMS27C32-10JL by Texas Instruments

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Applications Industrial Automation

Available Datasheets

Part # Manufacturer Description Datasheet
1606-10JLC Coilcraft Inc General Purpose Inductor, 0.01255uH, 5%, 1 Element, Air-Core, SMD, 1714, CHIP, 1714, ROHS COMPLIANT
1606-10JLB Coilcraft Inc General Purpose Inductor, 0.01255uH, 5%, 1 Element, Air-Core, SMD, 1714, CHIP, 1714, ROHS COMPLIANT
1812SMS-R10JLB Coilcraft Inc General Purpose Inductor, 0.1uH, 5%, 1 Element, Air-Core, SMD, 1925, ROHS COMPLIANT

Part Details for TMS27C32-10JL

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TMS27C32-10JL Part Data Attributes

TMS27C32-10JL Texas Instruments
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TMS27C32-10JL Texas Instruments 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description WDIP, DIP24,.6
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T24
Length 31.75 mm
Memory Density 32768 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WDIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 4.907 mm
Standby Current-Max 0.00025 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for TMS27C32-10JL

This table gives cross-reference parts and alternative options found for TMS27C32-10JL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS27C32-10JL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TMS27C32-10JE4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-10JE4
TMS27C32-10JE 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-10JE
TMS27C32-100JL4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-100JL4
TMS27C32-10JL4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-10JL4
TMS27C32-100JE4 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-100JE4
TMS27C32-100JL 4KX8 UVPROM, 100ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS27C32-100JL
AM2732B-100DI UVPROM, 4KX8, 100ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-100DI
AM2732B-100DC UVPROM, 4KX8, 100ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-100DC
Part Number Description Manufacturer Compare
AM2732B-200DE UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-200DE
AM2732B-250/BJA UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD TMS27C32-10JL vs AM2732B-250/BJA
CY7C244-45WC UVPROM, 4KX8, 45ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor TMS27C32-10JL vs CY7C244-45WC
AM9232BCC MASK ROM, 4KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, CERDIP-24 AMD TMS27C32-10JL vs AM9232BCC
QD2732A-20 UVPROM, 4KX8, 200ns, NMOS, CDIP24, CERDIP-24 Intel Corporation TMS27C32-10JL vs QD2732A-20
AM9233CPC MASK ROM, 4KX8, 300ns, MOS, PDIP24, PLASTIC, DIP-24 AMD TMS27C32-10JL vs AM9233CPC
H1837CD MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft TMS27C32-10JL vs H1837CD
LD2732A-20 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation TMS27C32-10JL vs LD2732A-20
CY7C243-55WMB UVPROM, 4KX8, 55ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor TMS27C32-10JL vs CY7C243-55WMB
TMS2732A-25JL 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments TMS27C32-10JL vs TMS2732A-25JL

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