Part Details for TM28C64-250 by LSI Corporation
Overview of TM28C64-250 by LSI Corporation
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- Part Data Attributes: (Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for TM28C64-250
TM28C64-250 CAD Models
TM28C64-250 Part Data Attributes
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TM28C64-250
LSI Corporation
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TM28C64-250
LSI Corporation
EEPROM, 8KX8, 250ns, Parallel, CMOS, CPGA28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
Package Description | PGA, PGA28,5X6 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 250 ns | |
Command User Interface | NO | |
Data Polling | YES | |
JESD-30 Code | R-XPGA-P28 | |
JESD-609 Code | e0 | |
Memory Density | 65536 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 8KX8 | |
Package Body Material | CERAMIC | |
Package Code | PGA | |
Package Equivalence Code | PGA28,5X6 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Page Size | 64 words | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.00025 A | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Toggle Bit | NO |