Datasheets
TC58NVM9S3EBAI3 by: Toshiba America Electronic Components

IC 64M X 8 FLASH 3.3V PROM, PBGA63, 8 X 13 MM, 0.80 MM PITCH, PLASTIC, TFBGA-63, Programmable ROM

Part Details for TC58NVM9S3EBAI3 by Toshiba America Electronic Components

Overview of TC58NVM9S3EBAI3 by Toshiba America Electronic Components

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Part Details for TC58NVM9S3EBAI3

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TC58NVM9S3EBAI3 Part Data Attributes

TC58NVM9S3EBAI3 Toshiba America Electronic Components
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TC58NVM9S3EBAI3 Toshiba America Electronic Components IC 64M X 8 FLASH 3.3V PROM, PBGA63, 8 X 13 MM, 0.80 MM PITCH, PLASTIC, TFBGA-63, Programmable ROM
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code BGA
Package Description VFBGA,
Pin Count 63
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
JESD-30 Code R-PBGA-B63
Length 13 mm
Memory Density 536870912 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 63
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64MX8
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Programming Voltage 3.3 V
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8.5 mm

Alternate Parts for TC58NVM9S3EBAI3

This table gives cross-reference parts and alternative options found for TC58NVM9S3EBAI3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC58NVM9S3EBAI3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NAND512R3A3CZA6 Flash, 64MX8, 15000ns, PBGA63, 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 Numonyx Memory Solutions TC58NVM9S3EBAI3 vs NAND512R3A3CZA6
K9K1208U0C-DIB00 Flash, 64MX8, 30ns, PBGA63, 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TBGA-63 Samsung Semiconductor TC58NVM9S3EBAI3 vs K9K1208U0C-DIB00
NAND512W3A3DZA1E 64MX8 FLASH 3V PROM, 12000ns, PBGA63, 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 STMicroelectronics TC58NVM9S3EBAI3 vs NAND512W3A3DZA1E
NAND512W3B2CZA1T 64MX8 FLASH 3V PROM, 25000ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 STMicroelectronics TC58NVM9S3EBAI3 vs NAND512W3B2CZA1T
NAND512W3B3CZA6 64MX8 FLASH 3V PROM, 35ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 STMicroelectronics TC58NVM9S3EBAI3 vs NAND512W3B3CZA6
NAND512W3B2AZA1T 64MX8 FLASH 3V PROM, 25000ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 STMicroelectronics TC58NVM9S3EBAI3 vs NAND512W3B2AZA1T
NAND512R3A2DZA6E 64MX8 FLASH 1.8V PROM, 15000ns, PBGA63, 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63 Numonyx Memory Solutions TC58NVM9S3EBAI3 vs NAND512R3A2DZA6E
NAND512R3B3CZA6F Flash, 64MX8, 35ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63 Numonyx Memory Solutions TC58NVM9S3EBAI3 vs NAND512R3B3CZA6F
NAND512R3A3BZA6 Flash, 64MX8, 15000ns, PBGA63, 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 Numonyx Memory Solutions TC58NVM9S3EBAI3 vs NAND512R3A3BZA6
NAND512R3A2BZA1T 64MX8 FLASH 1.8V PROM, 35ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 STMicroelectronics TC58NVM9S3EBAI3 vs NAND512R3A2BZA1T

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